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You Are Here : Home  >  Knowledge  >  Back Grinding Stone for Sapphire Thinning

Back Grinding Stone for Sapphire Thinning

:yinglong :2017-08-22 10:36:21

Back Grinding stone for Sapphire Thinning
 
General Information
In Front of the Original Semiconductor Processing, Grinding, Thinning and Polishing of the Wafer Substrate, a Wide Variety of Diamond Grinding stone would be Used for Back Grinding & Processing the Grinding stone.
Sapphire ThinningSapphire Thinning
 
Based on Various Types of Wafer Materials, like Sapphire Substrate, SiC Substrate, GaAs Substrate, Silicon Substrate, Different Diamond Grinding stones would be Chosen, such as Diamond Vitrified Grinding stones, Metal Grinding stones, Resin Grinding stones.
In the Process of Machining, “HeroHome” Diamond Grinding stones are with Long Life, Advantageous Grinding and Thinning Result, Great Extent to Meet the Industry Machining Accuracy and Surface Finish Requirements for Optical Industry and Solve the Weakness of Machining Scratches on the Wafer Surface.
Grinding stone for Sapphire Thinning
 
Regular Size of Grinding stones of Sapphire Grinding& Thinning;
Regular Size of Grinding stones of Sapphire Grinding& Thinning
 
 
 
OUR CONTACTS
Yinglong Superhard Materials Manufactory
ADD: Modern Industrial Zone, LinTong District, XiAn, CHINA
EMAIL: export.herohome@gmail.com
Fax: +86-29-63354775/83852230
Tel: +86-29-63354776/63354775
SKYPE: yinglong.herohome
PRODUCTS
Diamond Grinding Wheel
CBN Grinding Wheels
Common Grinding Wheel
Grinding Wheel Bond
Grinding Wheel Shapes
PCBN Insert
Cutting Blade
Abrasive Paste
Honing Tool
Dished No. 3 Grinding-wheel
CONTACT FORM
Yinglong Superhard Materials Manufactory (C)2018 Technical Support: SinoArt
+86-13619242158
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